SICK will be exhibiting at Interpack 2017

Sensor manufacturer SICK to exhibit at Interpack 2017Sensors, safety systems and automatic identification products manufacturer, SICK will be exhibiting at Interpack 2017.

Products, systems and services on display will include compact, easily integrated devices. There will also be configurable stand-alone solutions and programmable high-speed cameras. The company will focus on quality assurance in particular. The fast throughput speeds and short cycle times of production lines and machines in the packaging industry allow for high productivity. However, this can only be achieved if a comprehensive quality control system is in place. SICK will present new solutions. These will consist of its own modules and functions from image processing libraries that offer intelligent support for the packaging industry. Areas of focus are quality assurance, traceability, object data acquisition and preventive maintenance.

According to SICK, a 3D inspection system is the ideal solution in this area. It can reliably identify faulty product features, incomplete packaging units and inadequate labelling. The data and measurements produced by the vision sensors and its integration into real-time fieldbus environments enable them to provide valuable information. This can be used in today’s manufacturing plants and in smart factories of the future. The vision sensors have the necessary intelligent detection, measurement, assessment and communication functions to allow for future-proof process and quality controls in the context of Industry 4.0.